UV Release Dicing Tape
UV release tape is a functional process film coated with a specially formulated pressure-sensitive adhesive. It provides strong holding power during cutting, grinding or temporary protection, then rapidly reduces adhesion after UV exposure for clean and efficient removal.
Strong During Processing, Easy to Remove After UV Exposure
Before irradiation, the adhesive layer securely holds glass, ceramic, silicon wafers and electronic substrates in position. After controlled UV exposure, adhesion drops sharply, helping operators remove processed parts with less residue and lower risk of damage.
Typical Applications
Construction & Adhesion Change
The tape consists of a release liner, a UV-responsive pressure-sensitive adhesive layer and a film substrate. Its high initial tack supports stable processing. UV irradiation changes the adhesive properties and substantially lowers peel strength, allowing easier pickup or tape removal.
- High adhesion before UV exposure
- Low peel force after UV exposure
- Multiple thickness and holding-force options
- Selection available for cutting, grinding and protection processes
Model Comparison
| Model | Recommended Application | Base Film Thickness | Adhesive Thickness | Total Working Thickness | Peel Adhesion Before UV | Peel Adhesion After UV |
|---|---|---|---|---|---|---|
| BF165AL | Glass and ceramic wheel cutting; LED ceramic, EMC, small PCB, QFN and DFN substrates | 150 ± 4 μm | 15 ± 2 μm | 165 ± 6 μm | ≥ 1500 g/25 mm | ≤ 25 g/25 mm |
| BF160B | Thicker, harder or more highly warped glass, ceramic, LED ceramic and PCB substrates | 140 ± 3 μm | 20 ± 3 μm | 160 ± 6 μm | ≥ 1800 g/25 mm | ≤ 25 g/25 mm |
| BF-120AT | Wheel cutting of brittle ceramic and glass; designed to help reduce backside chipping | 100 ± 2 μm | 20 ± 3 μm | 120 ± 5 μm | ≥ 1500 g/25 mm | ≤ 15 g/25 mm |
| BF-110AL | Temporary protection during acid-treatment processes | 100 ± 3 μm | 10 ± 2 μm | 110 ± 5 μm | ≥ 1000 g/25 mm | ≤ 25 g/25 mm |
| BF90AL | Glass laser cutting, transfer of small components and silicon wafer dicing | 80 ± 3 μm | 10 ± 2 μm | 90 ± 5 μm | ≥ 800 g/25 mm | ≤ 25 g/25 mm |
Thickness: GB/T 6672-2001. Peel adhesion: GB/T 2792-1998. Values are reference specifications from the supplied product document and may be customized or confirmed before ordering.