{"product_id":"uv-release-dicing-tape","title":"UV Release Dicing Tape","description":"\u003cdiv class=\"lyfoo-uv-page\"\u003e\n  \u003cstyle\u003e\n    .lyfoo-uv-page{max-width:1200px;margin:0 auto;color:#263238;font-family:Arial,Helvetica,sans-serif;line-height:1.65}\n    .lyfoo-uv-page *{box-sizing:border-box}.lyfoo-uv-page h2,.lyfoo-uv-page h3{color:#17242b;line-height:1.3}\n    .lyfoo-uv-page h2{text-align:center;font-size:30px;margin:0 0 16px}.lyfoo-uv-page h3{font-size:23px;margin:34px 0 14px}\n    .lyfoo-intro{max-width:930px;margin:0 auto 30px;text-align:center;color:#52616a}\n    .lyfoo-hero{padding:42px 28px;background:linear-gradient(135deg,#eef8fd,#f8fbfc);border-radius:12px;margin-bottom:30px}\n    .lyfoo-layout-row{display:flex;gap:34px;align-items:center;margin:30px 0}.lyfoo-layout-row\u003ediv{flex:1;min-width:0}\n    .lyfoo-img{width:100%;display:block;border-radius:10px;background:#f2f5f6;object-fit:cover}\n    .lyfoo-image-placeholder{min-height:330px;display:flex;align-items:center;justify-content:center;text-align:center;color:#80919a;border:1px dashed #aebdc4;border-radius:10px;background:#f7f9fa;padding:20px}\n    .lyfoo-cards{display:grid;grid-template-columns:repeat(3,1fr);gap:16px;margin:18px 0 30px}.lyfoo-card{padding:20px;border:1px solid #dfe7ea;border-radius:9px;background:#fff}.lyfoo-card strong{display:block;color:#1176a5;margin-bottom:5px}\n    .lyfoo-note{padding:16px 18px;border-left:4px solid #1797ce;background:#eef8fc;margin:22px 0;color:#42545d}\n    .lyfoo-table-wrap{overflow-x:auto;margin:18px 0 28px;border:1px solid #dbe4e8;border-radius:9px}\n    .lyfoo-table{width:100%;border-collapse:collapse;min-width:900px;font-size:14px}.lyfoo-table th{background:#167da9;color:#fff;font-weight:600}.lyfoo-table th,.lyfoo-table td{padding:12px 11px;border:1px solid #dbe4e8;text-align:center;vertical-align:middle}.lyfoo-table tbody tr:nth-child(even){background:#f7fafb}.lyfoo-table td:first-child,.lyfoo-table td:nth-child(2){font-weight:600;color:#20323a}\n    .lyfoo-guide{display:grid;grid-template-columns:repeat(5,1fr);gap:12px;margin:18px 0}.lyfoo-guide div{padding:17px 14px;border-radius:8px;background:#f5f9fb;border-top:3px solid #1797ce}.lyfoo-guide strong{display:block;color:#17242b;margin-bottom:5px}\n    .lyfoo-list{padding-left:20px;margin:8px 0}.lyfoo-list li{margin-bottom:7px}\n    @media(max-width:800px){.lyfoo-layout-row{flex-direction:column}.lyfoo-cards{grid-template-columns:1fr 1fr}.lyfoo-guide{grid-template-columns:1fr 1fr}.lyfoo-hero{padding:30px 18px}}\n    @media(max-width:520px){.lyfoo-cards,.lyfoo-guide{grid-template-columns:1fr}.lyfoo-uv-page h2{font-size:26px}.lyfoo-uv-page h3{font-size:21px}}\n  \u003c\/style\u003e\n\n  \u003csection class=\"lyfoo-hero\"\u003e\n    \u003ch2\u003eUV Release Dicing Tape\u003c\/h2\u003e\n    \u003cp class=\"lyfoo-intro\"\u003eUV release tape is a functional process film coated with a specially formulated pressure-sensitive adhesive. It provides strong holding power during cutting, grinding or temporary protection, then rapidly reduces adhesion after UV exposure for clean and efficient removal.\u003c\/p\u003e\n  \u003c\/section\u003e\n\n  \u003csection class=\"lyfoo-layout-row\"\u003e\n    \u003cdiv\u003e\n      \u003c!-- Replace the placeholder below with the Shopify CDN URL for image 01: product rolls --\u003e\n      \u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0609\/3455\/3737\/files\/UV_Film-1_70f9af56-fa71-4fae-b04d-6242e2f09df7.jpg?v=1788571195\"\u003e\n    \u003c\/div\u003e\n    \u003cdiv\u003e\n      \u003ch3\u003eStrong During Processing, Easy to Remove After UV Exposure\u003c\/h3\u003e\n      \u003cp\u003eBefore irradiation, the adhesive layer securely holds glass, ceramic, silicon wafers and electronic substrates in position. After controlled UV exposure, adhesion drops sharply, helping operators remove processed parts with less residue and lower risk of damage.\u003c\/p\u003e\n      \u003cdiv class=\"lyfoo-note\"\u003eActual UV dose, exposure time and removal performance should be confirmed according to the substrate, surface condition and production process.\u003c\/div\u003e\n    \u003c\/div\u003e\n  \u003c\/section\u003e\n\n  \u003ch3\u003eTypical Applications\u003c\/h3\u003e\n  \u003cdiv class=\"lyfoo-cards\"\u003e\n    \u003cdiv class=\"lyfoo-card\"\u003e\n\u003cstrong\u003eGlass Cutting\u003c\/strong\u003eStable temporary fixation for wheel or laser cutting.\u003c\/div\u003e\n    \u003cdiv class=\"lyfoo-card\"\u003e\n\u003cstrong\u003eCeramic Cutting\u003c\/strong\u003eSuitable for brittle ceramic parts and LED ceramic substrates.\u003c\/div\u003e\n    \u003cdiv class=\"lyfoo-card\"\u003e\n\u003cstrong\u003eWafer Grinding \u0026amp; Dicing\u003c\/strong\u003eSupports silicon wafers during back grinding and separation.\u003c\/div\u003e\n    \u003cdiv class=\"lyfoo-card\"\u003e\n\u003cstrong\u003ePackage Substrate Dicing\u003c\/strong\u003eFor PCB, EMC, QFN and DFN substrate processing.\u003c\/div\u003e\n    \u003cdiv class=\"lyfoo-card\"\u003e\n\u003cstrong\u003eFlexible Glass Thinning\u003c\/strong\u003eTemporary support during thin-glass processing.\u003c\/div\u003e\n    \u003cdiv class=\"lyfoo-card\"\u003e\n\u003cstrong\u003eProcess Protection\u003c\/strong\u003eProtective holding for selected chemical and special processes.\u003c\/div\u003e\n  \u003c\/div\u003e\n\n  \u003csection class=\"lyfoo-layout-row\"\u003e\n    \u003cdiv\u003e\n      \u003ch3\u003eConstruction \u0026amp; Adhesion Change\u003c\/h3\u003e\n      \u003cp\u003eThe tape consists of a release liner, a UV-responsive pressure-sensitive adhesive layer and a film substrate. Its high initial tack supports stable processing. UV irradiation changes the adhesive properties and substantially lowers peel strength, allowing easier pickup or tape removal.\u003c\/p\u003e\n      \u003cul class=\"lyfoo-list\"\u003e\n        \u003cli\u003eHigh adhesion before UV exposure\u003c\/li\u003e\n        \u003cli\u003eLow peel force after UV exposure\u003c\/li\u003e\n        \u003cli\u003eMultiple thickness and holding-force options\u003c\/li\u003e\n        \u003cli\u003eSelection available for cutting, grinding and protection processes\u003c\/li\u003e\n      \u003c\/ul\u003e\n    \u003c\/div\u003e\n    \u003cdiv\u003e\n      \u003c!-- Replace the placeholder below with image 02: original structure diagram or a redrawn English diagram --\u003e\n      \u003cimg src=\"https:\/\/cdn.shopify.com\/s\/files\/1\/0609\/3455\/3737\/files\/UV_Film-800.jpg?v=1788571604\"\u003e\n    \u003c\/div\u003e\n  \u003c\/section\u003e\n\n  \u003ch3\u003eModel Comparison\u003c\/h3\u003e\n  \u003cdiv class=\"lyfoo-table-wrap\"\u003e\n    \u003ctable class=\"lyfoo-table\"\u003e\n      \u003cthead\u003e\u003ctr\u003e\n\u003cth\u003eModel\u003c\/th\u003e\n\u003cth\u003eRecommended Application\u003c\/th\u003e\n\u003cth\u003eBase Film Thickness\u003c\/th\u003e\n\u003cth\u003eAdhesive Thickness\u003c\/th\u003e\n\u003cth\u003eTotal Working Thickness\u003c\/th\u003e\n\u003cth\u003ePeel Adhesion Before UV\u003c\/th\u003e\n\u003cth\u003ePeel Adhesion After UV\u003c\/th\u003e\n\u003c\/tr\u003e\u003c\/thead\u003e\n      \u003ctbody\u003e\n        \u003ctr\u003e\n\u003ctd\u003eBF165AL\u003c\/td\u003e\n\u003ctd\u003eGlass and ceramic wheel cutting; LED ceramic, EMC, small PCB, QFN and DFN substrates\u003c\/td\u003e\n\u003ctd\u003e150 ± 4 μm\u003c\/td\u003e\n\u003ctd\u003e15 ± 2 μm\u003c\/td\u003e\n\u003ctd\u003e165 ± 6 μm\u003c\/td\u003e\n\u003ctd\u003e≥ 1500 g\/25 mm\u003c\/td\u003e\n\u003ctd\u003e≤ 25 g\/25 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n        \u003ctr\u003e\n\u003ctd\u003eBF160B\u003c\/td\u003e\n\u003ctd\u003eThicker, harder or more highly warped glass, ceramic, LED ceramic and PCB substrates\u003c\/td\u003e\n\u003ctd\u003e140 ± 3 μm\u003c\/td\u003e\n\u003ctd\u003e20 ± 3 μm\u003c\/td\u003e\n\u003ctd\u003e160 ± 6 μm\u003c\/td\u003e\n\u003ctd\u003e≥ 1800 g\/25 mm\u003c\/td\u003e\n\u003ctd\u003e≤ 25 g\/25 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n        \u003ctr\u003e\n\u003ctd\u003eBF-120AT\u003c\/td\u003e\n\u003ctd\u003eWheel cutting of brittle ceramic and glass; designed to help reduce backside chipping\u003c\/td\u003e\n\u003ctd\u003e100 ± 2 μm\u003c\/td\u003e\n\u003ctd\u003e20 ± 3 μm\u003c\/td\u003e\n\u003ctd\u003e120 ± 5 μm\u003c\/td\u003e\n\u003ctd\u003e≥ 1500 g\/25 mm\u003c\/td\u003e\n\u003ctd\u003e≤ 15 g\/25 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n        \u003ctr\u003e\n\u003ctd\u003eBF-110AL\u003c\/td\u003e\n\u003ctd\u003eTemporary protection during acid-treatment processes\u003c\/td\u003e\n\u003ctd\u003e100 ± 3 μm\u003c\/td\u003e\n\u003ctd\u003e10 ± 2 μm\u003c\/td\u003e\n\u003ctd\u003e110 ± 5 μm\u003c\/td\u003e\n\u003ctd\u003e≥ 1000 g\/25 mm\u003c\/td\u003e\n\u003ctd\u003e≤ 25 g\/25 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n        \u003ctr\u003e\n\u003ctd\u003eBF90AL\u003c\/td\u003e\n\u003ctd\u003eGlass laser cutting, transfer of small components and silicon wafer dicing\u003c\/td\u003e\n\u003ctd\u003e80 ± 3 μm\u003c\/td\u003e\n\u003ctd\u003e10 ± 2 μm\u003c\/td\u003e\n\u003ctd\u003e90 ± 5 μm\u003c\/td\u003e\n\u003ctd\u003e≥ 800 g\/25 mm\u003c\/td\u003e\n\u003ctd\u003e≤ 25 g\/25 mm\u003c\/td\u003e\n\u003c\/tr\u003e\n      \u003c\/tbody\u003e\n    \u003c\/table\u003e\n  \u003c\/div\u003e\n  \u003cp class=\"lyfoo-note\"\u003eThickness: GB\/T 6672-2001. Peel adhesion: GB\/T 2792-1998. Values are reference specifications from the supplied product document and may be customized or confirmed before ordering.\u003c\/p\u003e\n\n  \u003ch3\u003eQuick Selection Guide\u003c\/h3\u003e\n  \u003cdiv class=\"lyfoo-guide\"\u003e\n    \u003cdiv\u003e\n\u003cstrong\u003eBF165AL\u003c\/strong\u003eGeneral-purpose option for glass, ceramic and package-substrate cutting.\u003c\/div\u003e\n    \u003cdiv\u003e\n\u003cstrong\u003eBF160B\u003c\/strong\u003eHighest initial adhesion in the range for demanding or warped workpieces.\u003c\/div\u003e\n    \u003cdiv\u003e\n\u003cstrong\u003eBF-120AT\u003c\/strong\u003eLower post-UV adhesion and improved control of backside chipping.\u003c\/div\u003e\n    \u003cdiv\u003e\n\u003cstrong\u003eBF-110AL\u003c\/strong\u003eThin adhesive construction for acid-process protection.\u003c\/div\u003e\n    \u003cdiv\u003e\n\u003cstrong\u003eBF90AL\u003c\/strong\u003eThinnest option for laser cutting, wafer dicing and small-part transfer.\u003c\/div\u003e\n  \u003c\/div\u003e\n\u003c\/div\u003e","brand":"LYFOOCRANE","offers":[{"title":"Default Title","offer_id":48281379143817,"sku":null,"price":0.0,"currency_code":"USD","in_stock":false}],"thumbnail_url":"\/\/cdn.shopify.com\/s\/files\/1\/0609\/3455\/3737\/files\/UVFilm.jpg?v=1788571411","url":"https:\/\/www.lyfoo.com\/products\/uv-release-dicing-tape","provider":"LYFOOCRANE","version":"1.0","type":"link"}